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型號(hào)： 567 2KG KIT

品牌： DOW CORNING

類(lèi)別： 集成電路

描述： The 567 2KG KIT is a 2-part black heat cure primerless silicone Encapsulant Kit with good flame resistance. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. Sylgard silicone encapsulant cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Sylgard silicone elastomer requires no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulant may require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning. The Sylgard? 567 silicone encapsulant is suitable for general potting applications in applications like power supplies, connectors, amplifiers, relays and high voltage resistor packs and solar cells. . Flowable . Self-priming . No additional priming step required . Rapid, versatile cure processing controlled by temperature . Low viscosity enhances flow and fill in narrow spaces and around complex geometries . Good dielectric properties . UL94V-0 Flammability rating

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